Qualcomm will soon be coming up with yet another mid range chipset – Snapdragon 670. Expected to hit the market by the early part of 2018, the Qualcomm Snapdragon 670 is been reportedly manufactured using Samsung’s 10nm LPP technology. Incidentally, it was the same 10nm technology, which was behind used for the production of Snapdragon 835 and Exynos 8895 chips. The leaked information suggest that the testing platform contained a 4GB/6GB LPDDR4X RAM, with 64GB eMMC, 5.1 flash storage and WQHD screen.
Meanwhile, Qualcomm 845 is going to make debut next year with a number of highly awaited flagship models from various smartphone companies featuring the chipset.